RESIN SEALING MOLD AND RESIN SEALING METHOD

PROBLEM TO BE SOLVED: To provide a resin sealing mold in which an air vent is not necessary to be provided, a resin is not clogged and which has a good yield. SOLUTION: The resin sealing mold comprises a lower mold 20 which places a substrate 51 mounting a first semiconductor device 52 on a connecti...

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Bibliographische Detailangaben
Hauptverfasser:	HORIIKE MAKOTO, NODA JUNYA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin sealing mold in which an air vent is not necessary to be provided, a resin is not clogged and which has a good yield. SOLUTION: The resin sealing mold comprises a lower mold 20 which places a substrate 51 mounting a first semiconductor device 52 on a connecting surface, and an intermediate mold 30 having a cavity 31 at a position corresponding to the semiconductor device 52 of the connecting surface. And, in the resin sealing mold, the substrate 51 is sandwiched to be held between the lower mold 20 and the intermediate mold 30, and a melted resin 59 is filled in the cavity 31, and solidified to resin-seal the semiconductor device 52. Further, the part of the periphery of the cavity 31 of the intermediate mold 30 is superposed in a recess 26 for air vending of the intermediate mold 30 via the elastically deformable substrate 51. COPYRIGHT: (C)2008,JPO&INPIT