POLYAMIDE ADHESIVE AND UTILIZATION THEREOF

PROBLEM TO BE SOLVED: To provide an adhesive having excellent preservation stability of an adhesive solution, and preservation stability of an adhesive sheet formed into a sheet in a semicured state, and further excellent adhesive strength at high temperature in high humidity and solder heat resistance, and suitably usable for a flexible printed wiring board. SOLUTION: The adhesive contains a polyamide resin having ≤4.0 (mgKOH/g) amine value and an epoxy compound. The polyamide resin contains at least one kind of a long-chain alkylene component selected from the group consisting of (a) a long-chain alkylene diamine having a 10-12C alkylene chain between the amino groups, (b) an aminocarboxylic acid having 9-11C alkylene chain between the amino group and the carboxy group, (c) an intramolecular cyclic amide compound of the aminocarboxylic acid, and (d) a long-chain dicarboxylic acid having an 8-10C alkylene chain between the carboxy groups as a constituent component. COPYRIGHT: (C)2008,JPO&INPIT