SUBSTRATE PRODUCTION METHOD

SUBSTRATE PRODUCTION METHOD

PROBLEM TO BE SOLVED: To provide a filled via structure in which the surface of a via becomes substantially planar by filling the via with a plating to form arbitrarily plating conductor patterns having an uniform thickness on the surface of an insulating substrate, so that to form fine patterns. SO...

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Hauptverfasser: NAKAMURA SADASHI, SUGAWA TOSHIO, IWAZAWA AYAKO
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator NAKAMURA SADASHI
SUGAWA TOSHIO
IWAZAWA AYAKO
description PROBLEM TO BE SOLVED: To provide a filled via structure in which the surface of a via becomes substantially planar by filling the via with a plating to form arbitrarily plating conductor patterns having an uniform thickness on the surface of an insulating substrate, so that to form fine patterns. SOLUTION: This substrate production method comprises: a step of filling a conductor layer 7 by plating in a via 3 provided penetrating through an insulating substrate 2 from the surface to reverse surface thereof; and forming a conductor layer on which conductor patterns are formed by plating on at least the surface of the insulating substrate 2. The conductor patterns and the filling in the via 3 are formed by different plating from each other. COPYRIGHT: (C)2008,JPO&INPIT
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title SUBSTRATE PRODUCTION METHOD
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