SUBSTRATE PRODUCTION METHOD

PROBLEM TO BE SOLVED: To provide a filled via structure in which the surface of a via becomes substantially planar by filling the via with a plating to form arbitrarily plating conductor patterns having an uniform thickness on the surface of an insulating substrate, so that to form fine patterns. SOLUTION: This substrate production method comprises: a step of filling a conductor layer 7 by plating in a via 3 provided penetrating through an insulating substrate 2 from the surface to reverse surface thereof; and forming a conductor layer on which conductor patterns are formed by plating on at least the surface of the insulating substrate 2. The conductor patterns and the filling in the via 3 are formed by different plating from each other. COPYRIGHT: (C)2008,JPO&INPIT