PLUG-IN UNIT PACKAGING STRUCTURE AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a plug-in unit packaging structure capable of mounting plug-in units having different size to entire slots efficiently. SOLUTION: Printed-board PIUs 2, 3 having different sizes are packaged by using mount frames 12, 13 corresponding thereto. Box-shaped PIUs 4, 5 are...

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Bibliographische Detailangaben
Hauptverfasser:	FUJIMURA MITSUO, ARAKI HIDEO, ZENITANI HIDEKI, SATO YOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a plug-in unit packaging structure capable of mounting plug-in units having different size to entire slots efficiently. SOLUTION: Printed-board PIUs 2, 3 having different sizes are packaged by using mount frames 12, 13 corresponding thereto. Box-shaped PIUs 4, 5 are also mounted by using mount frames 14, 15 corresponding thereto. There are no guide rails for guiding the PIUs 2-5 for packaging in a metal shelf 1 itself. COPYRIGHT: (C)2008,JPO&INPIT