METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND SEMICONDUCTOR SUBSTRATE FOR SEMICONDUCTOR LIGHT-EMITTING ELEMENT

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light-emitting element, and a semiconductor substrate for semiconductor for light-emitting element, which shortens the manufacturing time of the semiconductor light-emitting element. SOLUTION: The method for manufacturing th...

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Bibliographische Detailangaben
Hauptverfasser: YAMADA ATSUSHI, NAGASHIMA YASUAKI, NISHIMOTO SUSUMU, SHIMOSE YOSHIHARU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light-emitting element, and a semiconductor substrate for semiconductor for light-emitting element, which shortens the manufacturing time of the semiconductor light-emitting element. SOLUTION: The method for manufacturing the semiconductor light-emitting element and the semiconductor substrate for semiconductor light-emitting element includes: in an n-type semiconductor substrate, an n-type clad layer lamination stage to laminate an n-type clad layer of a composition different to the n-type semiconductor substrate; a protective film formation stage to form a protective film on the upper surface of the n-type clad layer; a protective film removal stage to remove the protective film; an optical functional layer lamination stage to laminate an optical functional layer on the upper surface of the n-type clad layer where the protective film is removed; and a p-type clad layer lamination stage to laminate a p-type clad layer whose optical refractive index is smaller than the optical refractive index of the n-type clad layer on the upper surface of the optical functional layer. COPYRIGHT: (C)2008,JPO&INPIT