METHOD AND APPARATUS OF POLISHING

PROBLEM TO BE SOLVED: To provide a method and an apparatus of polishing, wherein the repeatability of polishing accuracy is improved, while the repeatability of polishing accuracy becomes more and more difficult due to the enlargement of the size of workpices, and the accurate surface polishing is m...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OBATA HIDEKI, BANDO YUTAKA, MATSUSHIMA YOHEI, OBATA TAKESHI
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!