METHOD AND APPARATUS OF POLISHING

PROBLEM TO BE SOLVED: To provide a method and an apparatus of polishing, wherein the repeatability of polishing accuracy is improved, while the repeatability of polishing accuracy becomes more and more difficult due to the enlargement of the size of workpices, and the accurate surface polishing is m...

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Bibliographische Detailangaben
Hauptverfasser: OBATA HIDEKI, BANDO YUTAKA, MATSUSHIMA YOHEI, OBATA TAKESHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method and an apparatus of polishing, wherein the repeatability of polishing accuracy is improved, while the repeatability of polishing accuracy becomes more and more difficult due to the enlargement of the size of workpices, and the accurate surface polishing is maintained. SOLUTION: In the surface polishing apparatus, a large rectangular workpiece 1 is arranged on a supporting base 11 having a horizontal plane. The surface of the workpiece 1 is polished by applying a pressing force to a polishing surface plate 20 having the size smaller than that of the workpiece 1 by means of a pneumatic cylinder, and also by moving it on the horizontal plane by applying a turning torque by means of a rotary driving motor, and while supplying polishing liquid to the polishing surface plate 20 from a slurry control section. In this case, the pressure of air in the pneumatic cylinder is controlled via a pressure regulating section, based on the preset values of the rotational speed of the motor, the pressure of air, and the setting value of a target electric power source. Alternatively, a polishing pattern data storing section is provided for storing driving electric power corresponding to a polishing pattern having the data in the past for the rotary driving motor, and the pressure of air in the pneumatic cylinder is controlled via a pressure regulating section. COPYRIGHT: (C)2008,JPO&INPIT