MODIFIED POLYAMIDE RESIN AND RESIN COMPOSITION COMPRISING THE SAME

PROBLEM TO BE SOLVED: To provide a modified polyamide resin excellent in migration resistance, preferably used as an adhesive for flexible printed circuit board excellent in adhesion under high humidity and solder heat-resistance. SOLUTION: The modified polyamide resin is obtained by reacting (a) a...

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1. Verfasser:	UMEZAWA MITSUO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a modified polyamide resin excellent in migration resistance, preferably used as an adhesive for flexible printed circuit board excellent in adhesion under high humidity and solder heat-resistance. SOLUTION: The modified polyamide resin is obtained by reacting (a) a diamine component, (b) a dicarboxylic acid component, (c1) an aminocarboxylic acid and/or (c2) an intramolecular cyclic amino compound of an amino carboxylic acid and (d) a component having an epoxy group, represented by general formula (1) and/or (e) a diol component represented by general formula 2, (in the formula, A is a polymeric part of a 2-20C olefin, R is a H or a 1-18C alkyl group.). COPYRIGHT: (C)2008,JPO&INPIT