ULTRASONIC PROBE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To solve a problem of complicated manufacturing steps in a conventional manufacturing method that a backing unit is manufactured and thereafter a pad array is formed in the case of manufacturing a resonator assembly provided into an ultrasonic probe. SOLUTION: A plurality of internal boards 30 and a plurality of backing plates are alternately arranged inside a frame 20 and a plurality of bump columns 32 are formed in advance to an end of a lead pattern of each internal board 30. A bump array 40 is configured with the bump columns 32. Each bump is formed swollen from a lead face and formed by plating processing or the like. A plurality of insertion grooves are formed corresponding to the plurality of bump arrays 40, and an external board is inserted to each insertion groove. In this state, the plurality of leads on the external board and the plurality of bumps are subjected to soldering processing. COPYRIGHT: (C)2008,JPO&INPIT