GOLD ALLOY FOR CONNECTING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a gold alloy for connecting a semiconductor device in which breakage or stripping of a wire is prevented in heat cycle after bonding. SOLUTION: The gold alloy for connecting a semiconductor device consists of 0.01-2 mass% of Cu, 0.01-0.3 mass% of Ge, and the reminder...

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Bibliographische Detailangaben

1. Verfasser:	MIKAMI MICHITAKA
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS METALLURGY SEMICONDUCTOR DEVICES TREATMENT OF ALLOYS OR NON-FERROUS METALS
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