SUBSTRATE, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a substrate capable of forming a fine pattern by arbitrarily setting the thickness of a plated conductor pattern on the surface of an insulating base material, and to provide a manufacturing method for the substrate. SOLUTION: A via 3 formed while being penetrated fr...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA SADASHI, SUGAWA TOSHIO, IWAZAWA AYAKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate capable of forming a fine pattern by arbitrarily setting the thickness of a plated conductor pattern on the surface of an insulating base material, and to provide a manufacturing method for the substrate. SOLUTION: A via 3 formed while being penetrated from the surface of the insulating base material 2 to a rear is filled with a plating, and the plated conductor pattern is formed on at least the surface of the insulating base material 2. The fine pattern can be formed even when the plating is formed in the via 3 approximately flatly by making the plated conductor pattern lower than a height projected from the surface of the insulating base material 2 of the plating filled to the via 3. COPYRIGHT: (C)2008,JPO&INPIT