SURFACE POLISHING DEVICE

PROBLEM TO BE SOLVED: To obtain a surface polishing device excellent in elevation driving performance, which supports an upper platen in a well-balanced manner. SOLUTION: An elevating device 8 driving the elevation of the upper polishing plate 1 between a polishing position and a non-polishing posit...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YAMATANI AKIHIKO, SHIMIZU TOSHIKUNI, NAKAJO YOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a surface polishing device excellent in elevation driving performance, which supports an upper platen in a well-balanced manner. SOLUTION: An elevating device 8 driving the elevation of the upper polishing plate 1 between a polishing position and a non-polishing position is provided with: three elevation driving mechanism parts 8A operated in synchronization; and a connection mechanism part 8B connecting these elevation driving mechanism parts 8A and the upper polishing plate 1. The elevation driving mechanism parts 8A are disposed in parallel at 120° intervals at positions surrounding the upper polishing plate 1 of a machine body. The connection mechanism part 8B is provided with three connection arms 12 extended in a radial direction at 120° intervals from a supporting part 11 supporting the upper polishing plate 1 and connected with the elevation driving mechanism parts 8A. COPYRIGHT: (C)2008,JPO&INPIT