PROCESS FOR MANUFACTURING POWER MODULE

PROBLEM TO BE SOLVED: To obtain a process for manufacturing a power module in which the reliability of power module can be enhanced by ensuring strong bonding of an insulation sheet and mold resin. SOLUTION: The process for manufacturing a power module comprises a step for mounting an insulation she...

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Bibliographische Detailangaben
Hauptverfasser:	KANO TAKETOSHI, SASAKI FUTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a process for manufacturing a power module in which the reliability of power module can be enhanced by ensuring strong bonding of an insulation sheet and mold resin. SOLUTION: The process for manufacturing a power module comprises a step for mounting an insulation sheet in the cavity of a mold, and mounting an electronic component on the insulation sheet; and a step for sealing the insulation sheet and the electronic component with resin by injecting mold resin into the cavity from the gate of the mold. An air vent is provided as the mold in the vicinity of a region for mounting the insulation sheet. COPYRIGHT: (C)2008,JPO&INPIT