PLATING METHOD AND METHOD FOR PRODUCING MICRODEVICE

PROBLEM TO BE SOLVED: To provide a plating method for forming plating patterns of a plurality of layers without complicating an operation so that each layer has almost the same composition. SOLUTION: Since the total area of a resist pattern 13, the total area of a resist pattern 17 and the total are...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MIYATA SHINGO, HORIUCHI SOHEI, OTSUBO YUJI, UEJIMA SATOSHI, YAMAGUCHI ATSUSHI, SAITO MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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