PLATING METHOD AND METHOD FOR PRODUCING MICRODEVICE

PROBLEM TO BE SOLVED: To provide a plating method for forming plating patterns of a plurality of layers without complicating an operation so that each layer has almost the same composition. SOLUTION: Since the total area of a resist pattern 13, the total area of a resist pattern 17 and the total are...

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Bibliographische Detailangaben
Hauptverfasser:	MIYATA SHINGO, HORIUCHI SOHEI, OTSUBO YUJI, UEJIMA SATOSHI, YAMAGUCHI ATSUSHI, SAITO MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a plating method for forming plating patterns of a plurality of layers without complicating an operation so that each layer has almost the same composition. SOLUTION: Since the total area of a resist pattern 13, the total area of a resist pattern 17 and the total area of a resist pattern 18 are all made equal, the areas of plating regions R13, R17 and R18 in plating each plating pattern A to C can be made always uniform. Thus, plating current density can be uniformly held with ease without changing current value, and the plating patterns A to C having almost equal compositions each other can consequently be extremely efficiently formed. COPYRIGHT: (C)2008,JPO&INPIT