METHOD FOR GENERATING AND ACCUMULATING NANOPARTICLES

PROBLEM TO BE SOLVED: To provide a one-step process for producing and depositing size-selected nanoparticles onto a substrate surface using ultrafast pulsed laser ablation of solid target materials. SOLUTION: This system includes a pulse laser, an optical system, and a vacuum chamber. The pulsed las...

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Bibliographische Detailangaben
Hauptverfasser:	BIN RIU, ZHENDONG HU, YONG CHE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F COMPOUNDS THEREOF DEVICES USING STIMULATED EMISSION DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INORGANIC CHEMISTRY MANUFACTURE OR TREATMENT THEREOF METALLURGY NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS,MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES ASDISCRETE UNITS NANOTECHNOLOGY NON-METALLIC ELEMENTS PERFORMING OPERATIONS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a one-step process for producing and depositing size-selected nanoparticles onto a substrate surface using ultrafast pulsed laser ablation of solid target materials. SOLUTION: This system includes a pulse laser, an optical system, and a vacuum chamber. The pulsed laser has various pulse duration ranging from a few femtoseconds to a few tens of picoseconds. The optical system processes a laser beam such that the beam is focused onto the target surface with an appropriate average energy density and an appropriate energy density distribution. The target and the substrate are installed inside the vacuum chamber, and the background gases and their pressures are appropriately adjusted. COPYRIGHT: (C)2008,JPO&INPIT