SUBSTRATE PROCESSOR

PROBLEM TO BE SOLVED: To provide a substrate processor capable of improving uniformity in immersion processing of a substrate. SOLUTION: The substrate processor 10a for performing immersion processing of the substrate is equipped with six supply pipes 2a-2f for supplying a process liquid into a proc...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YAMAMOTO KAZUHIKO, TOKURI KENTAROU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate processor capable of improving uniformity in immersion processing of a substrate. SOLUTION: The substrate processor 10a for performing immersion processing of the substrate is equipped with six supply pipes 2a-2f for supplying a process liquid into a processing reservoir 1. The six pipes 2a-2f are evenly provided at a height different from one another. In addition, the six pipes 2a-2f are alternately provided on two wall surfaces 11 and 12 in a height direction. Further, the pipes 2a-2f supply the process liquid in the approximately horizontal direction. Since a flow of the process liquid parallel to the approximately horizontal direction can thus be uniformly formed in the entire processing reservoir 1, occurrence of a swirling current and formation of retention can be effectively inhibited. As a result, uniformity can be improved in the immersion processing of the substrate W. COPYRIGHT: (C)2008,JPO&INPIT