METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To provide technology for bringing a probe into contact with a test pad corresponding to the probe by a desired contact pressure in probe inspection using a thin film probe formed by using manufacture technique of a semiconductor integrated circuit device. SOLUTION: The bending rigidity of a first region in the circumference of the probe 7E of an arrangement end of the probe 7 (a plurality of contact terminals) arranging face distribution of the bending rigidity of a thin film sheet 2 (a first sheet) possessed by a probe card used for the probe inspection at a constant interval is small by being compared with the bending rigidity of a second region in the circumference of the probes 7A and 7B between the arrangement ends. COPYRIGHT: (C)2008,JPO&INPIT