METHOD FOR SMOOTHING SURFACE OF WOOD FIBER BOARD BONDED TO SUBSTRATE AND VENEER LAMINATED DECORATIVE BOARD

PROBLEM TO BE SOLVED: To manufacture a compound substrate 10 where the surface of a wood fiber board 2 is smoothed without being affected by irregularity of a plywood substrate 3 side. SOLUTION: The cutting tool 20 having a blade body 23 is used and the cutting tool 20 is moved in parallel to the su...

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Hauptverfasser: NAKAMURA KIYOMASA, AKAEDA KOICHI
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creator NAKAMURA KIYOMASA
AKAEDA KOICHI
description PROBLEM TO BE SOLVED: To manufacture a compound substrate 10 where the surface of a wood fiber board 2 is smoothed without being affected by irregularity of a plywood substrate 3 side. SOLUTION: The cutting tool 20 having a blade body 23 is used and the cutting tool 20 is moved in parallel to the surface of the wood fiber board 2 in such a state that a pushing force to the plywood substrate 3 side is maintained so as not to be generated in the wood fiber board 2, and the surface of the wood fiber board 2 is cut off. COPYRIGHT: (C)2008,JPO&INPIT
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recordid cdi_epo_espacenet_JP2008006727A
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subjects LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
NAILING OR STAPLING MACHINES IN GENERAL
PERFORMING OPERATIONS
TRANSPORTING
WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL
WORKING VENEER OR PLYWOOD
title METHOD FOR SMOOTHING SURFACE OF WOOD FIBER BOARD BONDED TO SUBSTRATE AND VENEER LAMINATED DECORATIVE BOARD
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