METHOD FOR SMOOTHING SURFACE OF WOOD FIBER BOARD BONDED TO SUBSTRATE AND VENEER LAMINATED DECORATIVE BOARD

PROBLEM TO BE SOLVED: To manufacture a compound substrate 10 where the surface of a wood fiber board 2 is smoothed without being affected by irregularity of a plywood substrate 3 side. SOLUTION: The cutting tool 20 having a blade body 23 is used and the cutting tool 20 is moved in parallel to the su...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA KIYOMASA, AKAEDA KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM NAILING OR STAPLING MACHINES IN GENERAL PERFORMING OPERATIONS TRANSPORTING WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL WORKING VENEER OR PLYWOOD
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To manufacture a compound substrate 10 where the surface of a wood fiber board 2 is smoothed without being affected by irregularity of a plywood substrate 3 side. SOLUTION: The cutting tool 20 having a blade body 23 is used and the cutting tool 20 is moved in parallel to the surface of the wood fiber board 2 in such a state that a pushing force to the plywood substrate 3 side is maintained so as not to be generated in the wood fiber board 2, and the surface of the wood fiber board 2 is cut off. COPYRIGHT: (C)2008,JPO&INPIT