SOLID-STATE IMAGE PICKUP DEVICE

PROBLEM TO BE SOLVED: To solve the problem that reduction in thickness in the direction of an optical axis is prevented in the case of a process wherein a solid-state image pickup device and electronic components such as IC's for signal processing are stacked. SOLUTION: The solid-state image pi...

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Bibliographische Detailangaben
1. Verfasser:	MUSHA KAZUMI
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM CINEMATOGRAPHY ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY ELECTROGRAPHY HOLOGRAPHY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHOTOGRAPHY PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve the problem that reduction in thickness in the direction of an optical axis is prevented in the case of a process wherein a solid-state image pickup device and electronic components such as IC's for signal processing are stacked. SOLUTION: The solid-state image pickup device and the electronic components are mounted on a wiring board. The wiring board is folded along the side surface of a lens barrel. The electronic components mounted on the wiring board are arranged in opposed positions around an optical component support of the lens barrel. COPYRIGHT: (C)2008,JPO&INPIT