WAFER EDGE FACE PROTECTIVE DEVICE

PROBLEM TO BE SOLVED: To provide a wafer edge protective device for processing two or more wafers efficiently while preventing processing failure, such as wafer peeling. SOLUTION: By operating a pushing mechanism 43; a wafer pushing unit 25 and a wafer mounting unit 23 are approached, and two wafers W between the wafer pushing unit 25 and the wafer mounting unit 23 are pinched each by seal members 9, 33 so that two wafers W mounted on the wafer mounting unit 23 are put in a pushed state by the wafer pushing unit 25. In this way, processing failure, such as processing of the edge face of the wafer W by potassium hydroxide, and corroding of wax or the like which bonds the wafer W to a base member, by potassium hydroxide, can be prevented. In addition, if each wafer W is mounted on plural-wafer mounting plate 3, the edge face of two or more wafers W can be protected easily and thereby two or more wafers W are processed effectively. COPYRIGHT: (C)2008,JPO&INPIT