CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a circuit substrate including a conductor layer mainly formed of silver wherein an insulating layer has sufficiently high insulation reliability and high voltage resistance characteristic, and also to provide a method for manufacturing the same circuit substrate. SOL...

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Bibliographische Detailangaben
1. Verfasser:	FURUSE TATSUJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a circuit substrate including a conductor layer mainly formed of silver wherein an insulating layer has sufficiently high insulation reliability and high voltage resistance characteristic, and also to provide a method for manufacturing the same circuit substrate. SOLUTION: At least a kind or more of crystals among diopside (CaMgSi2O6), celsian (BaAl2Si2O8), forsterite (Mg2SiO4), enstatite (MgSiO3), cordierite (Mg2Al4Si5O18), and anorthite (CaAl2Si2O8), and spinel (MgAl2O4) are contained in an insulating layer. Accordingly, silver element is reduced as derived from a conductor layer existing in the insulating film. COPYRIGHT: (C)2008,JPO&INPIT