FLIP-CHIP PACKAGE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a flip-chip package in which contact resistance is reduced, a bonding effect is improved, and further superior reliability is provided, and to provide a method for manufacturing it. SOLUTION: This flip-chip package includes a first substrate 11 and a second substrate...

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Bibliographische Detailangaben
Hauptverfasser: KIM JONG-MIN, EOM YONG SEONG, MUN JONTE
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a flip-chip package in which contact resistance is reduced, a bonding effect is improved, and further superior reliability is provided, and to provide a method for manufacturing it. SOLUTION: This flip-chip package includes a first substrate 11 and a second substrate 12 on which pads are formed, respectively, a barrier formed on the first or second substrate, and an anisotropic conductive connection material which electrically connects the pads 13 and 14 of the first and second substrates. COPYRIGHT: (C)2008,JPO&INPIT