SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a stacked semiconductor package which can be made compact and has no decline in yield with an increase of the number of semiconductor chips to be stacked. SOLUTION: On a semiconductor unit mounting portion of a package substrate 1, a plurality of semiconductor units 5A and 5B are mounted in layers. The individual semiconductor units 5A and 5B include semiconductor chips 7A and 7B, conductor layers 8A and 8B to which the semiconductor chips 7A and 7B are flip-chip bonded, and sealing resins 10A and 10B for sealing the semiconductor chips 7A and 7B and flip-chip bonding portions 9A and 9B between the conductor layers 8A and 8B and the semiconductor chips 7A and 7B. The conductor layers 8A and 8B of the plurality of semiconductor units 5A and 5B are electrically connected to the connection pad 3 of the package substrate 1, and the plurality of semiconductor units 5A and 5B and electrically connections are sealed by a sealing resin 13 between the conductor layers 8A and 8B and the connection pad 3 of the package substrate 1. COPYRIGHT: (C)2008,JPO&INPIT