IC CHIP MOUNTING PACKAGE AND IMAGE DISPLAY UNIT USING THIS

PROBLEM TO BE SOLVED: To provide an IC chip (liquid crystal driver) mounting package in which no shorting occurs between wiring electrodes, even if the wiring electrode on a tape carrier touches an interposer substrate end when the interposer substrate is connected to the tape carrier. SOLUTION: In a liquid crystal driver mounting package 1a, a film base material 2 is connected to a liquid crystal driver 3 through an interposer substrate 4a. A film base material connecting terminal 13 of the interposer substrate 4a is connected to terminals of two sets of on-film wiring 5 and 6 of the film base material 2 by using an anisotropic conductive adhesive. An insulating film 7 is formed at the end of the interposer substrate 4a and around it. Therefor, even if the on-film wirings 5 and 6 contact with the insulating film 7, no shorting occurs between adjoining on-film wiring. COPYRIGHT: (C)2008,JPO&INPIT