ELECTRONIC COMPONENT DEVICE, MANUFACTURING METHOD THEREOF, AND THERMOSETTING RESIN SHEET FOR SEALING

ELECTRONIC COMPONENT DEVICE, MANUFACTURING METHOD THEREOF, AND THERMOSETTING RESIN SHEET FOR SEALING

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component device for sealing an electron device by filling a required portion in a wiring board with resin sufficiently with a simple process without inhibiting an electron function in the electron device, such as a surface aco...

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Hauptverfasser: NISHIMURA MITSUFUMI, NAKAKIMURA KEIKO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
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creator NISHIMURA MITSUFUMI
NAKAKIMURA KEIKO
description PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component device for sealing an electron device by filling a required portion in a wiring board with resin sufficiently with a simple process without inhibiting an electron function in the electron device, such as a surface acoustic wave element. SOLUTION: In the manufacturing method of the electronic component device 47, a thermosetting resin sheet 45 for sealing, where melt viscosity is 10-300 Pa s in heating and melting, is laminated on the electron device of the surface acoustic wave element 42, or the like fixed onto the wiring board 41, and the resin sheet is heated and cured, thus forming an airtight space 46 for sealing without inhibiting the electron function of the electron device with resin. COPYRIGHT: (C)2008,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
title ELECTRONIC COMPONENT DEVICE, MANUFACTURING METHOD THEREOF, AND THERMOSETTING RESIN SHEET FOR SEALING
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