ELECTRONIC COMPONENT DEVICE, MANUFACTURING METHOD THEREOF, AND THERMOSETTING RESIN SHEET FOR SEALING

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component device for sealing an electron device by filling a required portion in a wiring board with resin sufficiently with a simple process without inhibiting an electron function in the electron device, such as a surface acoustic wave element. SOLUTION: In the manufacturing method of the electronic component device 47, a thermosetting resin sheet 45 for sealing, where melt viscosity is 10-300 Pa s in heating and melting, is laminated on the electron device of the surface acoustic wave element 42, or the like fixed onto the wiring board 41, and the resin sheet is heated and cured, thus forming an airtight space 46 for sealing without inhibiting the electron function of the electron device with resin. COPYRIGHT: (C)2008,JPO&INPIT