PLASMA TREATMENT APPARATUS

PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus which can uniformly treat even a large substrate with plasma. SOLUTION: The plasma treatment apparatus comprises: a reaction chamber with an airtight structure; a gas-introducing port for introducing a gas into the reaction chamber; a low...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: WATARI SOICHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus which can uniformly treat even a large substrate with plasma. SOLUTION: The plasma treatment apparatus comprises: a reaction chamber with an airtight structure; a gas-introducing port for introducing a gas into the reaction chamber; a lower electrode installed inside the reaction chamber; an upper electrode and a gas distributor which are installed inside the reaction chamber and are placed so as to face the lower electrode respectively; and a gas-exhausting port for exhausting a gas from the reaction chamber. The upper electrode has a plurality of upper electrode holes. The gas distributor has a plurality of gas distribution holes which are uniformly distributed. The gas-introducing port is placed so that the introduced gas from the gas-introducing port passes through the gas distribution holes and the upper electrode holes in this sequential order or in the reverse order, is supplied to a space between the upper electrode and the lower electrode, and is converted into plasma by high-frequency voltage applied between the upper electrode and the lower electrode. The gas distributor is formed from a material having a smaller coefficient of linear expansion or a larger Young's modulus than either of the upper electrode. COPYRIGHT: (C)2008,JPO&INPIT