MANUFACTURING DEVICE OF PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To surely prevent the occurrence of connection failures or the like in a manufacturing device of a printed circuit board. SOLUTION: The manufacturing device of the printed circuit board solders a packaged component 2 on a printed wiring board 1. The printed circuit board is con...

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Bibliographische Detailangaben
1. Verfasser:	SUGINO SHIGERU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To surely prevent the occurrence of connection failures or the like in a manufacturing device of a printed circuit board. SOLUTION: The manufacturing device of the printed circuit board solders a packaged component 2 on a printed wiring board 1. The printed circuit board is constituted of a preparatory treatment device 6 for supplying high density unmelted solder 5 to a gap between a through-hole 3 of the printed wiring board 1 and a lead 4 of a through-hole packaged component 2A, and a solder melting device 7 for melting and hardening the solder 5. COPYRIGHT: (C)2008,JPO&INPIT