POLYAMIDE ADHESIVE AND ITS USE

PROBLEM TO BE SOLVED: To provide an adhesive which is excellent in curability and also in adhesive force at a high temperature and high humidity and solder heat resistance, and is suitably applicable to a flexible printed wiring board. SOLUTION: The adhesive contains a polyamide resin having 5-50 (m...

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1. Verfasser: UMEZAWA MITSUO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an adhesive which is excellent in curability and also in adhesive force at a high temperature and high humidity and solder heat resistance, and is suitably applicable to a flexible printed wiring board. SOLUTION: The adhesive contains a polyamide resin having 5-50 (mg KOH/g) amine value and an epoxy compound, and is characterized by the followings. The polyamide resin comprises, as its constitutional component, at least one long-chain alkylene component selected from the group consisting of (a) a long-chain alkylene diamine having a 10-12C alkylene chain between the amino groups, (b) an amino carboxylic acid having a 9-11C alkylene chain between the amino group and carboxy group or (c) an intramolecular cyclic amide compound formed from the amino carboxylic acid, and (d) a long-chain alkylene dicarboxylic acid having an 8-10C alkylene chain between the carboxy groups. COPYRIGHT: (C)2008,JPO&INPIT