LASER BEAM CUTTING DEVICE AND LASER BEAM CUTTING METHOD

PROBLEM TO BE SOLVED: To provide a laser beam cutting device capable of ensuring the high working efficiency, and preventing breakage of a product during the cutting work. SOLUTION: The laser beam cutting device 1 is used for separating a brittle plate 50 to be worked into a product and a remaining...

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Bibliographische Detailangaben
Hauptverfasser:	YANO KOZABURO, KIDO MASAMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a laser beam cutting device capable of ensuring the high working efficiency, and preventing breakage of a product during the cutting work. SOLUTION: The laser beam cutting device 1 is used for separating a brittle plate 50 to be worked into a product and a remaining peripheral material, and comprises a placement stand 20 including a placement part for placing a product area of the brittle plate 50 becoming a product after the cutting, laser beam cutting mechanisms 11-15 for separating a remaining peripheral material area of the brittle plate 50 becoming the remaining peripheral material after the cutting from the product area of the brittle plate 50 by irradiating a cutting-scheduled area of the brittle plate 50 placed on the placement part with laser beams, and remaining peripheral material collecting mechanisms 16-18 which are located below the loading stand 20 and collect a remaining peripheral material 52 separated and dropped from the product area of the brittle plate 50 by the laser beam cutting mechanisms 11-15. COPYRIGHT: (C)2008,JPO&INPIT