ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide an electronic component capable of improving a sealing property. SOLUTION: An electronic component 10 comprises: (1) a substrate 12; (2) a functional portion 24 formed on the principal surface 12a of the substrate 12; (3) a supporting layer 30 disposed over the whole...

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Bibliographische Detailangaben
Hauptverfasser:	KUDO NORIZANE, IWAMOTO TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic component capable of improving a sealing property. SOLUTION: An electronic component 10 comprises: (1) a substrate 12; (2) a functional portion 24 formed on the principal surface 12a of the substrate 12; (3) a supporting layer 30 disposed over the whole circumference around the functional portion 24 on the principal surface 12a of the substrate 12, and extending inside the outer circumference 12b of the substrate 12 when viewed from the normal direction of the principal surface 12a of the substrate 12; (4) a cover layer 52 disposed on the supporting layer 30 so as to face the principal surface 12a of the substrate 12 at an interval, and extending inside the outer circumference 12b of the substrate 12 when viewed from the normal direction of the principal surface 12a of the substrate 12; and (5) a metal film 60 extending over between the substrate 12 and the supporting layer 30, and between the supporting layer 30 and the cover layer 52 to cover gaps between the substrate 12 and the supporting layer 30 and between the supporting layer 30 and the cover layer 52. COPYRIGHT: (C)2008,JPO&INPIT