FUNCTIONAL ELEMENT, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION USED IN THE SAME AND METHOD FOR MANUFACTURING FUNCTIONAL ELEMENT

PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition used in a functional element in which two bases placed opposite to each other are bonded together by way of a structure obtained from the negative photosensitive resin composition, the negative photosensitive resin composit...

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Bibliographische Detailangaben
Hauptverfasser:	KAWADA YOSHIHIRO, MIYAGAWA NAOFUSA, UMEYAMA TOMOE
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FREQUENCY-CHANGING HOLOGRAPHY LABELS OR NAME-PLATES MATERIALS THEREFOR NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition used in a functional element in which two bases placed opposite to each other are bonded together by way of a structure obtained from the negative photosensitive resin composition, the negative photosensitive resin composition being excellent in pattern resolution and in adhesiveness of the structure to the bases. SOLUTION: In the functional element in which a second base is pressure-bonded onto a first base by way of a patterned structure provided by photolithography to bond the two bases together, a resin composition for forming the structure is the negative photosensitive resin composition comprising (A) an acrylic monomer, (B) a hydrogenated product of an alkali-soluble polymer obtained by copolymerizing an unsaturated carboxylic acid and another unsaturated compound or an alkali-soluble phenolic resin, (C) a photopolymerization initiator and (D) an epoxy compound. Such a negative photosensitive resin composition has excellent pattern resolution and excels also in adhesiveness to the opposite bases. COPYRIGHT: (C)2008,JPO&INPIT