FLAME-RETARDANT HALOGEN-FREE EPOXY RESIN COMPOSITION, PREPREG USING THE SAME AND LAMINATED PLATE FOR ELECTRIC WIRING BOARD

PROBLEM TO BE SOLVED: To provide an epoxy resin composition that has excellent heat resistance, anti-tracking property, high safety and flame retardancy, and provide prepreg and laminated plate for electric wire board using the same. SOLUTION: In an epoxy resin composition composed of epoxy resin, c...

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Hauptverfasser: IKEDA KENICHI, OHORI KENICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an epoxy resin composition that has excellent heat resistance, anti-tracking property, high safety and flame retardancy, and provide prepreg and laminated plate for electric wire board using the same. SOLUTION: In an epoxy resin composition composed of epoxy resin, curing agent and additives, (a) the contents of halogen and antimony compounds are less than 0.1 wt.% in all of the materials, (b) at least one of the curing agent is a modified phenol resin being a polycondensate of a compound containing phenols and triazine ring and aldehyde and is dissolved in methyl ethyl ketone by less than 80 wt.% of solid component and additively, a novolac resin of phenols is mixed and (c) a flame-retardation-assisling action-having additive is included in this non-halogen epoxy resin composition (wherein the resin composition for sealing semiconductor is excluded). Further, the prepregs and laminated plate for electric wiring board using the non-halogen flame-retardant epoxy resin are provided. COPYRIGHT: (C)2008,JPO&INPIT