PHENOLC COMPOUND, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent flame retardance, solder resistance and reliability of moisture resistance and to provide a semiconductor device using the same. SOLUTION: The epoxy resin composition consists essentially of a compound (A) and a phenolic co...

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1. Verfasser:	TAKEDA YUKINORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent flame retardance, solder resistance and reliability of moisture resistance and to provide a semiconductor device using the same. SOLUTION: The epoxy resin composition consists essentially of a compound (A) and a phenolic compound (B). The compound (A) has ≥2 epoxy groups in one molecule. The phenolic compound (B) is represented by general formula (1) [wherein, R1to R4represent each hydrogen, an alkyl group or a phenyl group; and m and n are each 0 or an integer of ≥1]. COPYRIGHT: (C)2008,JPO&INPIT