DUST REMOVAL DEVICE, AND METHOD THEREFOR

PROBLEM TO BE SOLVED: To make it possible to remove dust in a package securely, and to prevent resticking prior to the sealing of the package on which a semiconductor chip is mounted in the manufacturing of the semiconductor device in which the semiconductor chip is contained in a cavity. SOLUTION:...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OSAKI HIROTO, TAMURA YOSHIKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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