DUST REMOVAL DEVICE, AND METHOD THEREFOR

DUST REMOVAL DEVICE, AND METHOD THEREFOR

PROBLEM TO BE SOLVED: To make it possible to remove dust in a package securely, and to prevent resticking prior to the sealing of the package on which a semiconductor chip is mounted in the manufacturing of the semiconductor device in which the semiconductor chip is contained in a cavity. SOLUTION:...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OSAKI HIROTO, TAMURA YOSHIKAZU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To make it possible to remove dust in a package securely, and to prevent resticking prior to the sealing of the package on which a semiconductor chip is mounted in the manufacturing of the semiconductor device in which the semiconductor chip is contained in a cavity. SOLUTION: The dust removal device is made to be a structure having a dust suction 12 such as dust suction nozzle 14 etc. which opens facing to the inside of a package 1 or to the surface of a semiconductor chip 2. Since it has a dust suction structure where dust hardly disperse fundamentally, that is, the dust suction nozzle 14 is made to open in the vicinity of the inside of the package 1 or the surface of the semiconductor chip 2, the flow velocity in the suction is made large enabling secure suction of dust. COPYRIGHT: (C)2008,JPO&INPIT