DUST REMOVAL DEVICE, AND METHOD THEREFOR
PROBLEM TO BE SOLVED: To make it possible to remove dust in a package securely, and to prevent resticking prior to the sealing of the package on which a semiconductor chip is mounted in the manufacturing of the semiconductor device in which the semiconductor chip is contained in a cavity. SOLUTION:...
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creator | OSAKI HIROTO TAMURA YOSHIKAZU |
description | PROBLEM TO BE SOLVED: To make it possible to remove dust in a package securely, and to prevent resticking prior to the sealing of the package on which a semiconductor chip is mounted in the manufacturing of the semiconductor device in which the semiconductor chip is contained in a cavity. SOLUTION: The dust removal device is made to be a structure having a dust suction 12 such as dust suction nozzle 14 etc. which opens facing to the inside of a package 1 or to the surface of a semiconductor chip 2. Since it has a dust suction structure where dust hardly disperse fundamentally, that is, the dust suction nozzle 14 is made to open in the vicinity of the inside of the package 1 or the surface of the semiconductor chip 2, the flow velocity in the suction is made large enabling secure suction of dust. COPYRIGHT: (C)2008,JPO&INPIT |
format | Patent |
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SOLUTION: The dust removal device is made to be a structure having a dust suction 12 such as dust suction nozzle 14 etc. which opens facing to the inside of a package 1 or to the surface of a semiconductor chip 2. Since it has a dust suction structure where dust hardly disperse fundamentally, that is, the dust suction nozzle 14 is made to open in the vicinity of the inside of the package 1 or the surface of the semiconductor chip 2, the flow velocity in the suction is made large enabling secure suction of dust. COPYRIGHT: (C)2008,JPO&INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071115&DB=EPODOC&CC=JP&NR=2007300006A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071115&DB=EPODOC&CC=JP&NR=2007300006A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OSAKI HIROTO</creatorcontrib><creatorcontrib>TAMURA YOSHIKAZU</creatorcontrib><title>DUST REMOVAL DEVICE, AND METHOD THEREFOR</title><description>PROBLEM TO BE SOLVED: To make it possible to remove dust in a package securely, and to prevent resticking prior to the sealing of the package on which a semiconductor chip is mounted in the manufacturing of the semiconductor device in which the semiconductor chip is contained in a cavity. 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SOLUTION: The dust removal device is made to be a structure having a dust suction 12 such as dust suction nozzle 14 etc. which opens facing to the inside of a package 1 or to the surface of a semiconductor chip 2. Since it has a dust suction structure where dust hardly disperse fundamentally, that is, the dust suction nozzle 14 is made to open in the vicinity of the inside of the package 1 or the surface of the semiconductor chip 2, the flow velocity in the suction is made large enabling secure suction of dust. COPYRIGHT: (C)2008,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | DUST REMOVAL DEVICE, AND METHOD THEREFOR |
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