ANALYZING SAMPLE FORMING METHOD
PROBLEM TO BE SOLVED: To provide an analyzing sample forming method which enables the formation of an analyzable sample by reducing the damage applied to the film of an analysis sample. SOLUTION: In the analyzing sample forming method, first, the periphery of the first film 13a being the peeled part...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an analyzing sample forming method which enables the formation of an analyzable sample by reducing the damage applied to the film of an analysis sample. SOLUTION: In the analyzing sample forming method, first, the periphery of the first film 13a being the peeled part of the film 13 formed on a substrate 12 is cut by a converged ion beam processing device (FIB) 15 in order to analyze the foreign matter 14 present between the first film 13a and the substrate 12. Next, a carbon tape is pasted on the first film 13a and drawn up to separate the first film 13a and a second film 13b to remove only the first film 13a from the surface of the substrate 12. By this method, the surface of the first film 13a, to which the foreign matter 14 adheres, and the part of the substrate 12 are exposed. COPYRIGHT: (C)2008,JPO&INPIT |
---|