SYSTEM OF REDUCING OXIDATION FOR USE IN WIRE BONDING

PROBLEM TO BE SOLVED: To provide a method and an apparatus for reducing oxidation in wire bonding. SOLUTION: A wire bonding apparatus is provided. More specifically, the system relates to the delivery of a cover gas to a bond site region of the wire bonding apparatus. That is, this wire bonding appa...

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Bibliographische Detailangaben
Hauptverfasser:	GILLOTTI GARY S, FRASCH E WALTER, MAK STEVEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method and an apparatus for reducing oxidation in wire bonding. SOLUTION: A wire bonding apparatus is provided. More specifically, the system relates to the delivery of a cover gas to a bond site region of the wire bonding apparatus. That is, this wire bonding apparatus includes the bond site region which holds a semiconductor element during wire bonding operation, and a gas supply line which is configured to supply the gas to the bond site region from its upper side. COPYRIGHT: (C)2008,JPO&INPIT