THIN FILM DEPOSITING METHOD

PROBLEM TO BE SOLVED: To provide a thin film depositing method by which an alignment mark used for positioning a mask can be surely recognized as a black image. SOLUTION: The thin film depositing method comprises positioning a mask 10 relatively to a substrate 20 based on the reflection light from a...

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Bibliographische Detailangaben
1. Verfasser:	BUSHIMATA SUSUMU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a thin film depositing method by which an alignment mark used for positioning a mask can be surely recognized as a black image. SOLUTION: The thin film depositing method comprises positioning a mask 10 relatively to a substrate 20 based on the reflection light from a positioning hole 12 penetrating the mask 10 and then depositing a thin film having a prescribed pattern on the surface of the substrate. The mask 10 is held on a mask holder 30; a conical mask holder hole 32 is formed in the mask holder, and the central axis AX1 of the positioning hole 12 is deviated from the central axis AX2 of the mask holder hole 32. COPYRIGHT: (C)2008,JPO&INPIT