CUTTING METHOD FOR SHIELDED CONDUCTOR LAYER, AND LASER BEAM MACHINING APPARATUS

PROBLEM TO BE SOLVED: To provide a cutting method for shielded conductor layer capable of preventing a shield line not to be cut from being remained on a side surface of a shield conductor layer, and sufficiently ensuring the insulation between an internal conductor and the shield conductor layer, a...

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Bibliographische Detailangaben
Hauptverfasser:	KURATA TADASHI, MIYAKOSHI TOKUJI
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CONVERSION OR DISTRIBUTION OF ELECTRIC POWER CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRICITY GENERATION INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a cutting method for shielded conductor layer capable of preventing a shield line not to be cut from being remained on a side surface of a shield conductor layer, and sufficiently ensuring the insulation between an internal conductor and the shield conductor layer, and a laser beam machining apparatus. SOLUTION: In the cutting method for shield conductor layer, a shield cable 1 comprised of a center conductor, an internal insulator arranged to cover the center conductor, and a shield conductor layer arranged to cover the internal insulator is prepared. The shield conductor layer is cut by irradiating laser beams on the shield conductor layer from at least three directions which are substantially orthogonal to the longitudinal direction of the shield cable 1. The angle formed by adjacent two optical axes of the laser beams irradiated on the shield conductor layer is below 180°. COPYRIGHT: (C)2008,JPO&INPIT