ETCHING TREATING DEVICE AND ETCHING TREATING METHOD

PROBLEM TO BE SOLVED: To obtain an etching treating device capable of preventing a chemical replacement cost from increasing and a treated waste liquid from increasing and stabilizing an etched amount. SOLUTION: The etching treating device including an etching means for etching a material formed on a semiconductor substrate with the chemical liquid that is an aqueous solution containing hydrofluoric acid and/or ammonium fluoride, and a water washing means for washing the etched semiconductor substrate with a purified water, wherein the etching means is provided with a chemical liquid cooling function that controls the chemical liquid that is allowed to contact the material formed on the semiconductor substrate at a temperature in a scope that the chemical liquid is not frozen at a temperature of 20°C or less. COPYRIGHT: (C)2008,JPO&INPIT