METHOD FOR MANUFACTURING THIN SUBSTRATE AND MANUFACTURING EQUIPMENT

PROBLEM TO BE SOLVED: To provide a method for easily manufacturing a thin substrate in low cost by bonding two thin sheets to reduce face wobbling. SOLUTION: A process of bonding thin substrate sheets is carried out by using equipment made by installing a spacer to a turn table having through holes...

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1. Verfasser: IDO HIROSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for easily manufacturing a thin substrate in low cost by bonding two thin sheets to reduce face wobbling. SOLUTION: A process of bonding thin substrate sheets is carried out by using equipment made by installing a spacer to a turn table having through holes for inflow of air. By rotating the thin substrate sheets on the turn table, adhesive for bonding is spun off and hardened. COPYRIGHT: (C)2008,JPO&INPIT