EQUIPMENT AND METHOD FOR BONDING ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide equipment including an electronic device, adhesive agent and a circuit board, in which the electronic device is bonded. SOLUTION: The circuit board has a construction that is improved for raising speed of filling and shape forming of the adhesive agent arranged on th...

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Bibliographische Detailangaben
Hauptverfasser:	CHEN CHIHING, LIU LIANG-JUNG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide equipment including an electronic device, adhesive agent and a circuit board, in which the electronic device is bonded. SOLUTION: The circuit board has a construction that is improved for raising speed of filling and shape forming of the adhesive agent arranged on the bottom of the electronic device. When the electronic device is arranged on the circuit board in such a state that the edge of the electronic device is coated with the adhesive agent; the electronic device can be quickly bonded on the circuit board, and air existing in an interlayer can be ejected between the electronic device and the circuit board through a hole. In addition, a method is provided for quickly bonding the electronic device on the circuit board. COPYRIGHT: (C)2008,JPO&INPIT