METHOD AND APPARATUS FOR INSPECTING SUBSTRATE, AND METHOD AND APPARATUS FOR REPAIRING SUBSTRATE

PROBLEM TO BE SOLVED: To accurately and appropriately index a position on a substrate at a short-circuiting section extremely quickly without causing any complexity, or the like in work, when inspecting the short-circuiting of a plurality of electrode patterns formed on the substrate. SOLUTION: If a...

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Hauptverfasser: OKAJI KUNIO, FUJIKAWA JUNJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To accurately and appropriately index a position on a substrate at a short-circuiting section extremely quickly without causing any complexity, or the like in work, when inspecting the short-circuiting of a plurality of electrode patterns formed on the substrate. SOLUTION: If a prescribed current flows when executing a voltage application process for bringing a plurality of probes 4 in a probe tool 5 into contact with one edge of a plurality of electrode patterns 3 formed in a stripe on a glass substrate 2 for successively applying voltage between adjacent probes 4, a position in an electrode pattern arrangement direction Y on the glass substrate 2 at a short-circuiting section 3a is obtained, based on the electrode patterns 3 corresponding to the probe 4 where the flow of the current is detected, and a position in a direction X along the electrode pattern on the glass substrate 2 at the short-circuiting section 3a is obtained based on the level of the current value. COPYRIGHT: (C)2008,JPO&INPIT