PROCESSING LIQUID SUPPLY NOZZLE AND SUBSTRATE PROCESSOR PROVIDED THEREWITH

PROBLEM TO BE SOLVED: To provide a processing liquid supply nozzle and substrate processor that enable reduction in the consumption of a processing liquid and redeposition of the processing liquid onto a substrate, while securing uniformity of supply of the processing liquid to the surface of the substrate, without causing cost increase. SOLUTION: A nozzle 3 is provided with a tubular holding member 7 and a processing-liquid discharge pipe 8 inserted into the holding member 7. The holding member 7 is formed into a flare shape, being expanded so as to be further apart from the central axial line, as going to the tip side, and is arranged in a state in which its tip is directed obliquely and downwardly. The processing-liquid discharge pipe 8 has a rectangularly annular cross-sectional shape. The tip of the processing-liquid discharge pipe 8 is provided so as to be in non-contact with the holding member 7, and becomes a free end 9 that is floatable in a direction orthogonal to a longitudinal direction of a discharge port 10. The processing liquid is discharged toward a wafer W from the discharge port 10 of the processing-liquid discharge pipe 8, while the tip of the processing-liquid discharge pipe 8 is being oscillated vertically, by allowing a nitrogen gas to flow in a gas circulation path 13. COPYRIGHT: (C)2008,JPO&INPIT