RESIN PASTE FOR DIE BONDING, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE BY USING THE SAME, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a paste easily being supplied/coated by a printing method to a supporting member required to be stuck at a comparatively low temperature, enabling steps of the conversion to a B stage and post-curing to be carried out by different methods to shorten the time for a B...

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Bibliographische Detailangaben
Hauptverfasser:	EHANA SATORU, KAWASUMI MASAO, DODO TAKASHI, HASEGAWA YUJI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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